Chiplet
6 reportsCoverage places memory and interconnects; manufacturing constraints; and chip architecture within the wider context of Chiplet. The account uses power measurements to define the observation and independent hardware analysis to test its interpretation in relation to manufacturing constraints; uncertainty persists because vendor specifications may not represent sustained performance in real workloads.
SEALSQ and IC'Alps Target 2026 for Quantum-Resistant ASIC Prototype
SEALSQ Corp and its French subsidiary IC'Alps have detailed progress on QASIC, a custom post-quantum ASIC platform aiming to embed quantum-resistant cryptography directly into application-specific silicon for sectors including automotive and healthcare
Rigetti Splits System Delivery From Quantum Processor R&D
Rigetti Computing has reorganized its operations, creating a dedicated Systems Delivery group to manage manufacturing and deployment of superconducting quantum hardware, while consolidating processor R&D into a separate technology division
SMIC Struggles to Meet AI Chip Demand as Capacity Hits 93.7 Percent
China's largest contract chipmaker, SMIC, reports near-maximum factory utilization as demand for mature-node chips supporting AI infrastructure outpaces supply, prompting price increases and plans for further capacity expansion
OpenLight and Tower Expand Photonic Chip Design With Integrated Lasers
OpenLight and Tower Semiconductor have released a photonic design kit for Cadence EDA tools, enabling engineers to develop high-speed photonic integrated circuits with on-chip lasers for data centers and optical systems
Rigetti Reports Revenue Growth and U.S. CHIPS Act Quantum Funding
Rigetti Computing has reported a sharp increase in revenue, new U.S. government funding under the CHIPS Act, and a partnership with Hewlett Packard Enterprise to deploy superconducting quantum processors in hybrid supercomputing environments
Micro-Transfer Printing Advances Heterogeneous Silicon Photonics Integration
Researchers have demonstrated micro-transfer printing to combine materials like III-V semiconductors and lithium niobate with silicon photonics, addressing integration challenges for faster optical computing and communications hardware